New Model of SMD-2007

Desktop Automatic Reflow Oven SMD-2007, Lead-Free Model New SMD-2007: $2,915.00 Click here for models purchased before December 2004 l          Full automatic fuzzy logic temperature control. l          Back light LCD display. l          Can be used for any surface mount components. l          Can also be used for two sides PCB boards. l          IR+hot air. l          RS232 computer interface and software. l          Lead-free reflow capable. l          The new model has front view window, the top can be opened for easy heater replacement. l          Great for repair preheating. l          Meets IPC standard. l          Temperature to 300°C. l          Working area: 400mmx350mmX30mm(14"x16"x1"). l          External measurement: 600mm(w) x465mm (d) x500mm (h). l          Working cycle 5 minutes per board. Beeps when the board is done. l          Manual draw. l          Built in automatic air cool. l          One profile stored in EPROM, can be modified with keypads. l          No programming necessary, no computer interface. l          No datalog. l          3.5KW power, 220V. We have transformers for 110V power supply. It works with 208V supply, but not with 240V or higher. l          Weight: 32Kg without the packing material.   User's manual. Standard Profile Curve Snap shot of the reflow oven LCD display OPERATIONAL INSTRUCTIONS 1. Profile setting The preheat and reflow temperatures and durations can be changed. The reflow oven goes into profile setting mode after the "SET" key is pressed. Press the ∧ or ∨ key to increment or decrement the highlighted number. Press the "SET" key again to switch to the next temperature or time. Press the "ENTER" key to finish the profiling process and to save the profile. Default setting:         Regular double side boards:   160°C-150S, 220°C-40S, 220°C-10S.         Multi-layer boards:    175°C-160S, 230°C-40S, 230°C-15S.         Aluminum, porcelain boards:185°C-150S, 240°C-40S, 240°C-30S. It may be necessary to adjust the temperatures and durations 2-4°C, 5-10S for different paste. Temperature and Tim Ranges:         Preheat temperature W1: 150°C to 190°C. Preheat temperature should be lower than reflow temperature.         Preheat time T1: 100-160S. Should be greater than preheat temperature-90.             For example: when preheat temperature is 160°C, preheat time should be >70S.         Reflow 1 temperature W2: 215°C to 250°C.         Reflow 1 time T2: 30S to 60S. T2 is time the oven takes to reach temperature W2.         Reflow 2 temperature W3: 215°C to 250°C.         Reflow 2 time T3: 10-50S. T3 is the time the oven can stay at reflow temperature. 2. Temperature Sensor Handling It is very important for the temperature sensor to have accurate reading to make perfect circuit boards. There are two versions of temperature sensor mounting: 1. The sensor hangs down in the back of the oven chamber: The sensor in this version of SMD-2007 model is supposed to touch the circuit board. A convenient method to achieve this is to tape the sensor on to a heat sampling board with the supplied heat resistant tape. The heat sampling board can be an unused circuit board with the same layer numbers and made with the same material as the board to be assembled. It has the same or similar heat characteristics. The sampling board can be left inside the oven all the time. The sensor can also be taped on the board being worked directly if it is a one board only, or if the board is too big. 2. The sensor is housed inside a steel pipe above the oven chamber: The sensor in the newest SMD-2007 model is mounted in this way. Nothing needs to be done with the temperature sensor in this model. But keep in mind that the displayed temperature is the oven chamber air temperature, not the actually temperature of the circuit board, which is normally lower than the air temperature. 3. Reflowing It is necessary to run the reflow oven one to two cycles to warm it up before actually working process. Open the draw and gently place the circuit board on it.The circuit board should be placed in the center of the working area, leaving some distance from the front door. Push the draw into the heating area. Press the "Soldering" key. The LCD screen displays the internal temperature as the heating progresses. The board is done when the reflow oven rings. Wait till the ring stops before taking out the board and starting another reflow cycle. 4. Preheat This process is the same as the reflow process except that the board needs to be taken out as soon as the temperature reaches 220°C, before the normal reflow process is finished. The SMT parts can be removed at this time. 5. Computer software The SMD-2007 reflow oven comes with RS232 connection and software. Customer profiles can be saved or downloaded to the oven from a computer. The computer software also displays real time operation results. Functions of the computer software: 1. File: Open: open saved profile Save: save current profile Print: print current profile Exit: close the program 2. Set: Port Select: Select computer serial port, COM1 or COM2, default COM1 Parameter Transfer: Transfer current temperature and time setting from the computer to the oven 3. Communicate: Parameter Load: upload the current profile from the oven to the computer Stop Communicate: stop the upload of the profile to the computer 4. Run: Run: start the reflow process Stop: Stop the reflow process. Download the computer software here. Download this serial port dirver, MSCOMM32.OCX, and save it to the "windows" directory on your computer if the above error message shows up. 6. Recommended Solder Paste The reflow oven does not come with solder paste. The following paste has been tested and recommended: Kester Easy Profile 256. FCT NC650. We will be happy to test your paste if provided. 7. Operational Notes: * It is very important to keep in mind that the displayed temperature is the sensor temperature. It may differ significantly from the PCB board temperature if the sensor is not placed properly. Also, if the oven model is with a sensor hanging above the PCB board, the displayed temperature is the air temperature. * The optimum reflow starting temperature is at 80°C to 90°C. If the starting temperature is much lower than 80°C, the front draw can be opened to stop the current process when the temperature reaches 90°C, and start it again immediately at that temperature. * Let the reflow oven cool down for 30 minutes after four hours of continues working. * Check the heat tubes inside the reflow oven at least once a year, or as necessary. The back panel needs to be opened to do this. * There are a few issues affecting the quality of the finished circuit boards:         Solder paste profile: please refer to the manufacturer's data sheet.         PCB board size: It is recommended to place extremely small boards(like 1"x1" or smaller) on a big unused PCB board or aluminum foil to increase heat absorption. Very large PCB board may also need to increase temperatures and time.         PCB board layers: the more the board layers, the higher the temperatures should be. * For the same batch of boards, if some are finished fine and some not, the profile temperatures or time are not enough. Adjust them higher or longer. * It is recommended to increase or decrease the preheat or reflow temperatures by 5°C every adjustment. * For double side board, first cook one side, then the other. No need to use glue. * There are a total of eight RI heating tubes inside the reflow oven. Sometimes they may get damaged during shipping or burnt out. The IR tubes can be viewed and accessed by opening the back panel. The reflow oven will not have enough heat if bad tubes not replaced. It is recommended to check them after you receive the reflow oven and start using it. It is necessary to check them at least once a year.