SURFACE MOUNT EQUIPMENT FOR PROTOTYPES AND SMALL PRODUCTION   Desktop Automatic Reflow Oven SMD-2004A, Lead-Free Model List Price: $3,800.00 Sale Price: $2,350.00 Click here for models purchased before August 2004 l          Full automatic fuzzy logic temperature control. l          Back light LCD display. l          Can be used for any surface mount components. l          Can also be used for two sides PCB boards. l          IR+hot air. l          RS232 computer interface and software. l          Lead-free reflow capable. l          Great for repair preheating. l          Meets IPC standard. l          Temperature to 300°C. l          Working area: 400mmx350mmX30mm. l          External measurement: 600mm(w) x465mm (d) x500mm (h). l          Temperature uniformity ±2°C. l          Working cycle 5 minutes per board. Beeps when the board is done. l          Manual draw. l          Built in automatic air cool. l          One profile stored in EPROM, can be modified with keypads. l          No programming necessary, no computer interface. l          No datalog. l          3.5KW power, 220V. We have transformers for 110V power supply. It works with 208V supply, but not with 240V or higher. l          Weight: 32Kg without the packing material.   User's manual. Standard Profile Curve Snap shot of the reflow oven LCD display OPERATIONAL INSTRUCTIONS 1. Profile setting The preheat and reflow temperatures and durations can be changed. The reflow oven goes into profile setting mode after the "SET" key is pressed. Press the ∧ or ∨ key to increment or decrement the highlighted number. Press the "SET" key again to switch to the next temperature or time. Press the "ENTER" key to finish the profiling process and to save the profile. Default setting:         Regular double side boards:   160°C-150S, 220°C-40S, 220°C-10S.         Multi-layer boards:    175°C-160S, 230°C-40S, 230°C-15S.         Aluminum, porcelain boards:185°C-150S, 240°C-40S, 240°C-30S. It may be necessary to adjust the temperatures and durations 2-4°C, 5-10S for different paste. Temperature and Tim Ranges:         Preheat temperature: 150°C to 190°C. Preheat temperature should be lower than reflow temperature.         Preheat time: 100-160S. Should be greater than preheat temperature-90.             For example: when preheat temperature is 160°C, preheat time should be >70S.         Reflow 1 temperature: 215°C to 250°C.         Reflow 1 time: 30S to 60S.         Reflow 2 temperature: 215°C to 250°C.         Reflow 2 time: 10-50S. 2. Temperature Sensor Handling It is very important for the temperature sensor to have accurate reading to make perfect circuit boards. The sensor in the new SMD-2000A model is supposed to touch the circuit board. A convenient method to achieve this is to tape the sensor on to a heat sampling board with the supplied heat resistant tape. The heat sampling board can be an unused circuit board with the same layer numbers and made with the same material as the board to be assembled. It has the same or similar heat characteristics. The sampling board can be left inside the oven all the time. The sensor can also be taped on the board being worked directly if it is a one board only, or if the board is too big. 3. Reflow It is necessary run the reflow oven one to two cycles to warm it up before every working shift. Open the draw and gently place the circuit board on it.The circuit board should be placed in the center of the working area, leaving some distance from the front door. Push the draw into the heating area. Press the "Soldering" key. The LCD screen displays the internal temperature as the heating progresses. The board is done when the reflow oven rings. Wait till the ring stops before taking out the board and starting another reflow cycle. 4. Preheat This process is the same as the reflow process except that the board needs to be taken out as soon as the temperature reaches 220°C, before the normal reflow process is finished. The SMT parts can be removed at this time. 5. Recommended Solder Paste The reflow oven does not come with solder paste. The following paste has been tested and recommended: Kester Easy Profile 256. FCT NC650. We will be happy to test your paste if provided. 6. Operational Notes: * Let the reflow oven cool down for 30 minutes after four hours of continues working. * Check the heat tubes inside the reflow oven at least once a year, or as necessary. The back panel needs to be opened to do this. * There are a few issues affecting the quality of the finished circuit boards:         Solder paste profile: please refer to the manufacturer's data sheet.         PCB board size: It is recommended to place extremely small boards(like 1"x1" or smaller) on a big unused PCB board or aluminum foil to increase heat absorption. Very large PCB board may also need to increase temperatures and time.         PCB board layers: the more the board layers, the higher the temperatures should be. * For the same batch of boards, if some are finished fine and some not, the profile temperatures or time are not enough. Adjust them higher or longer. * It is recommended to increase or decrease the preheat or reflow temperatures by 5°C every adjustment. * For double side board, first cook one side, then the other. No need to use glue. * There are a total of eight IR heating tubes inside the reflow oven. Sometimes they may get damaged during shipping or burnt out. The IR tubes can be viewed and accessed by opening the back panel. The reflow oven will not have enough heat if bad tubes not replaced. It is recommended to check them after you receive the reflow oven and start using it. It is necessary to check them at least once a year.