Fast heat up, 10 seconds to reach 250°C.
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Built
in temperature sensor for stable temperature control.
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Hot
and cool air selection for chip preheating or cooling.
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Used
together with a hot air rework station and fixture for BGA
and other IC's.
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Power:
460W.
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Temperature:
120°C to 250°C(at nozzle).
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Air
volume: 0.18 cubic meter/min.
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Size:
100(W) x60 (H) x170 (D) mm.
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Weight:
1kg.
User's manual
